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2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Conductive Production Grade MOS Grade

Detalhes do produto

Lugar de origem: China

Marca: ZMSH

Certificação: rohs

Número do modelo: Bolacha sic Epitaxial

Termos de pagamento e envio

Quantidade de ordem mínima: 25

Preço: by case

Detalhes da embalagem: Pacote em sala limpa de grau 100

Tempo de entrega: 5-8weeks

Termos de pagamento: T/T

Habilidade da fonte: 1000 pcs por mês

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6inch SiC Epitaxial Wafer

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4inch SiC Epitaxial Wafer

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SiC Epitaxial Wafer Production Grade

Estrutura cristalina:
Monocristal 4H-SiC
Tamanho:
2inch 3inch 4inch 6inch
Diâmetro/espessura:
Personalizado
Resistividade:
0,01–100 Ω·cm
A rugosidade da superfície:
<0,2 nm (Ra)
TTV:
< 5 μm
Estrutura cristalina:
Monocristal 4H-SiC
Tamanho:
2inch 3inch 4inch 6inch
Diâmetro/espessura:
Personalizado
Resistividade:
0,01–100 Ω·cm
A rugosidade da superfície:
<0,2 nm (Ra)
TTV:
< 5 μm
2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Conductive Production Grade MOS Grade

 

2inch 3inch 4inch & 6inch SiC epitaxial wafers - overview

 
 

 

2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Conductive Production Grade MOS Grade

 
 
 

Company Profile:

 

As a leading SiC (Silicon Carbide) wafer supplier, ZMSH specialize in the production, processing, and global distribution of high-quality 4H-N-type conductive and MOS-grade epitaxial wafers in 2-inch (50.8mm), 3-inch (76.2mm), 4-inch (100mm), and 6-inch (150mm) diameters, with capabilities extending up to 12-inch (300mm) for future industry demands.

 

 

Our product portfolio includes:

 

· 4H-N-type & 6H-N-type conductive SiC substrates (for power devices)

· High-Purity Semi-Insulating (HPSI) & SEMI-standard wafers (for RF applications)

· 4H/6H-P-type & 3C-N-type SiC wafers (for specialized semiconductor needs)

· Custom doping, thickness, and surface finishes (CMP, epi-ready, etc.)

 

With advanced CVD epitaxial growth technology, strict quality control (ISO 9001), and full in-house processing capabilities, we serve automotive, power electronics, 5G, and aerospace industries worldwide.

 

 


 

Key parameters (2inch, 3inch, 4inch, 6inch 4H-N-Type Epi Wafers)

 
 
Parameter Specifications
Crystal Structure 4H-SiC (N-type)
Diameter 2" / 3" / 4" / 6"
Epi Thickness 5-50 µm (custom)
Doping Concentration 1e15~1e19 cm⁻³
Resistivity 0.01–100 Ω·cm
Surface Roughness <0.2 nm (Ra)
Dislocation Density <1×10³ cm⁻²
TTV (Total Thickness Variation) <5 µm
Warpage <30 µm

 

 

(All specs customizable – contact us for project-specific requirements.)

 

 


 

Key features of 4H-N SiC epitaxial wafers

 
2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Conductive Production Grade MOS Grade 0

1. Superior Electrical Performance

 

· Wide bandgap (3.2 eV) & high breakdown voltage (>2 MV/cm) for high-power devices

· Low on-resistance (R<sub>on</sub>) for efficient power conversion

 

 

2. Excellent Thermal Properties

 

· High thermal conductivity (4.9 W/cm·K) for better heat dissipation

· Stable up to 600°C+, ideal for harsh environments

 

 

3. High-Quality Epitaxial Layer

 

· Low defect density (<1×10³ cm⁻²) for reliable device performance

· Uniform thickness (±2%) and doping control (±5%) for consistency

 

 

4. Multiple Wafer Grades Available

 

· Conductive Grade (for diodes, MOSFETs)

· MOSFET Grade (ultra-low defects for high-performance transistors)

 

 


Primary applications of 4H-N SiC epitaxial wafers

 

 

2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Conductive Production Grade MOS Grade 1

1. Electric Vehicles (EVs) & Fast Charging

 

· SiC MOSFETs & Schottky diodes for inverters and OBCs (higher efficiency than Si)

 

 

2. Renewable Energy & Industrial Power

 

· Solar inverters, wind turbines, and smart grids (lower energy loss)

 

 

3. 5G & RF Communications

 

· GaN-on-SiC RF devices for 5G base stations (high-frequency operation)

 

 

4. Aerospace & Defense

 

· Radar, satellite comms, and high-voltage systems (extreme environment stability)

 

 

5. Consumer & Industrial Electronics

 

· High-efficiency PSUs, motor drives, and UPS systems

 

 


 

ZMSH's Services of 4H-N SiC epitaxial wafers

 

 

2inch 3inch 4inch 6inch SiC Epitaxial Wafers 4H-N Conductive Production Grade MOS Grade 2

1. Full-Cycle Manufacturing & Customization

· SiC substrate production (2" to 12")

· Epitaxial growth (CVD) with controlled doping (N/P-type)

· Wafer processing (lapping, polishing, laser marking, dicing)

 

 

2. Testing & Certification

· XRD (crystallinity), AFM (surface roughness), Hall effect (carrier mobility)

· Defect inspection (etch pit density, micropipes <1/cm²)

 

 

3. Global Supply Chain Support

· Fast prototyping & bulk order fulfillment

· Technical consulting for SiC device design

 

 

 

Why Choose Us?

✔ Vertical integration (substrate → epitaxy → finished wafer)

✔ High yield & competitive pricing

✔ R&D support for next-gen SiC devices

✔ Fast lead times & global logistics

(For datasheets, samples, or quotes – reach out today!)

 

 


 

FAQ of 4H-N SiC epitaxial wafers

 

 

1. Q: What are the key differences between 2-inch, 4-inch and 6-inch SiC epitaxial wafers?

A: The main differences are in production scalability (6" enables higher volume) and cost-per-chip (larger wafers reduce device costs by ~30%).

 

 

2. Q: Why choose 4H-SiC over silicon for power devices?

A: 4H-SiC offers 10x higher breakdown voltage and 3x better thermal conductivity than silicon, enabling smaller, more efficient power systems.

 

 

 

Tags: #2inch 3inch 4inch 6inch, #SiC Epitaxial Wafers, #Silicon Carbide#4H-N, #Conductive, #Production Grade, #MOS Grade