2-inch DSP Sapphire Wafer 200 µm Al₂O₃ for LED & Optical Applications
Product Overview
Our 2-inch Double Side Polished (DSP) sapphire wafers are precision-engineered from high-purity monocrystalline aluminum oxide (Al₂O₃). With ultra-flat, epi-ready surfaces and minimal bow, these wafers are ideal for GaN epitaxial growth, high-precision optics, semiconductor devices, and camera applications.
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Product Highlights & Specifications
| Parameter | Specification |
|---|---|
| Material | High-purity monocrystalline sapphire (Al₂O₃) |
| Diameter | 50.8 mm (2-inch) |
| Thickness | 200 µm ± 15 µm |
| Surface Finish | Double Side Polished (DSP), epi-ready |
| Wafer Orientation | C-axis (0001) standard; custom orientations available |
| Bow | <10 µm |
| Total Thickness Variation (TTV) | ≤ 10 µm |
| Warp | ≤ 10 µm |
| Front Surface Roughness | Ra ≤ 0.3 nm |
| Back Surface Roughness | Ra = 1.0 ± 0.2 µm |
| Edge | 45° or C-shape |
| Packaging | Vacuum-sealed, Class 100 cleanroom, 25 pcs per cassette |
| Customization | Thickness, orientation, and shape available on request |
Key Advantages
High Hardness: Mohs 9, second only to diamond, ensuring excellent scratch and wear resistance.
Optical Transparency: Wide spectral transmission from near-UV to mid-IR for high-efficiency photon use.
Thermal & Chemical Stability: Thermal conductivity ~42 W/m·K, stable up to 1800–1900°C, resistant to acids and alkalis.
Precision Manufacturing: Ultra-flat surfaces with low bow and TTV, suitable for epi-ready applications.
Applications
Substrates for GaN epitaxial growth (LEDs, laser diodes)
High-precision optical components (lenses, windows)
Semiconductor test substrates
Infrared imaging systems
Photonics and camera modules
FAQ
Q: Can thickness and orientation be customized?
A: Yes, custom thicknesses from 100 µm to 500 µm and orientations (C, A, R, M) are available.
Q: What is the minimum order quantity?
A: 25 pcs per order.
Q: How is quality ensured?
A: Each wafer undergoes pre-production sample testing, final inspection, and Class 100 cleanroom vacuum packaging.
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